Sentry Matrix
Placental Tissue
Sentry Matrix is an advanced dermal matrix engineered to enhance wound healing and tissue regeneration. Derived from human skin tissue, Sentry Matrix provides a robust extracellular matrix (ECM) that promotes cellular migration, neovascularization, and the rebuilding of dermal structures in both acute and chronic wounds. Its unique properties make it an ideal solution for complex wounds requiring advanced treatment.
Description Of Layers
Sentry Matrix is crafted from human dermal tissue and retains the essential biochemical and structural components of the native dermis. It features a composite of collagen fibers (Types I, III, IV, and V), elastin, hyaluronic acid, and other ECM proteins, including laminin and fibronectin. These naturally occurring proteins create a supportive framework that encourages tissue regeneration and supports the healing process. The dermal matrix is designed to mirror the architecture of the skin, offering a functional scaffold that aids in tissue remodeling, collagen deposition, and wound closure.
Safety
Sentry Matrix is made from carefully sourced, consented human tissue, collected from donors undergoing full-term C-sections. All tissue is screened according to the rigorous standards of the U.S. Food and Drug Administration (FDA) and the American Association of Tissue Banks (AATB). Each donor is thoroughly screened to meet the highest safety protocols. Additionally, Sentry Matrix undergoes a validated terminal sterilization process to ensure safety and eliminate any risk of disease transmission. Detailed information regarding screening procedures and safety can be found in the product package insert or Instructions for Use.
Product Overview & Usage Guide
Product Specifications
- 1. Smith, J., Peirovi, H., et al., “Role of Acellular Dermal Matrices in Wound Healing,” J Tissue Eng Reg Med, vol. 15, pp. 33-40, 2021.
- 2. Lee, R., Mantay, M., Brannan, C., “Exploring the Use of Acellular Dermal Matrix in Regenerative Medicine,” Regenerative Medicine Reviews, vol. 2022, pp. 1-14.
